Two expectations informed end-users have of electric motor service centers are reliable best practice repairs and root cause failure analysis (RCFA) to prevent recurring failures. Service centers ...
When there’s a major systems outage or performance issue, IT teams come to the rescue to restore services as quickly as possible. Some IT organizations follow IT service management (ITSM) incident ...
Incident response teams across application reliability, infrastructure resilience, information security, and system and technology support are continuously trying to solve mysteries with missing ...
Editor’s note: This article is the second in a series to help practitioners learn about the AICPA’s new quality management standards and prepare to implement them. The interrelated final standards on ...
Natalie Gross is a freelance journalist and podcast producer based in the Washington, D.C., area. She has a master’s degree in journalism from Georgetown University. The morning of Aug. 16, 2019 began ...
The Joint Commission has determined the 10 most common causes of sentinel events reported in the first six months of 2013. An organization reporting a sentinel event submits a root cause analysis to ...
A new PCAOB spotlight report provides staff observations regarding the potential positive impact of performing a root cause analysis on the quality of audits performed by PCAOB-registered public ...
A monthly overview of things you need to know as an architect or aspiring architect. Unlock the full InfoQ experience by logging in! Stay updated with your favorite authors and topics, engage with ...
Three weeks after a massive IT outage brought the world to its knees, CrowdStrike has just unveiled a detailed Root Cause Analysis report. The July 19 systems crash left an indelible mark, causing ...
New York system puts a twist on root cause analysis When it comes to quality and safety improvement, healthcare leaders spend plenty of time analyzing adverse events and what led up to an unfavorable ...
The semiconductor industry is undergoing a profound transformation. What once centered on single-die silicon packaged in QFN or BGA formats has evolved into a landscape of multi-die integration, ...